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MPXM2102AS датащи(PDF) 299 Page - Motorola, Inc |
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MPXM2102AS датащи(HTML) 299 Page - Motorola, Inc |
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299 / 670 page ![]() 3–153 Motorola Sensor Device Data www.motorola.com/semiconductors High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated Motorola’s MPXH6300A series sensor integrates on–chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on–chip integration make the Motorola pressure sensor a logical and economical choice for the system designer. The MPXH6300A series piezoresistive transducer is a state–of–the–art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Features • Improved Accuracy at High Temperature • Available in Small and Super Small Outline Packages • 1.5% Maximum Error over 0° to 85°C • Ideally suited for Microprocessor or Microcontroller–Based Systems • Temperature Compensated from –40° to +125°C • Durable Thermoplastic (PPS) Surface Mount Package Application Examples • Aviation Altimeters • Industrial Controls • Engine Control/Manifold Absolute Pressure (MAP) • Weather Station and Weather Reporting Device Barometers Figure 1. Fully Integrated Pressure Sensor Schematic VS SENSING ELEMENT Vout GND THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1 GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY PINS 1, 5, 6, 7 AND 8 ARE NO CONNECTS MOTOROLA SEMICONDUCTOR TECHNICAL DATA MPXH6300A SERIES INTEGRATED PRESSURE SENSOR 20 to 304 kPa (3.0 to 42 psi) 0.3 to 4.9 Volts Output PIN NUMBER NOTE: Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is denoted by the chamfered corner of the package. 1 2 3 N/C VS Gnd 5 6 7 N/C N/C N/C MPXH6300A6T1 CASE 1317 MPXH6300AC6T1 CASE 1317A 4Vout 8 N/C SUPER SMALL OUTLINE PACKAGE REV 0 Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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