MPXM2102AS datasheet(251/670 Pages) MOTOROLA

251 / 670 page

MPX5050 MPXV5050G SERIES

3–105

Motorola Sensor Device Data

www.motorola.com/semiconductors

Figure 3 illustrates the Differential/Gauge Sensing Chip in

the basic chip carrier (Case 867). A fluorosilicone gel isolates

the die surface and wire bonds from the environment, while

allowing the pressure signal to be transmitted to the sensor

diaphragm.

The MPX5050/MPXV5050G series pressure sensor oper-

ating characteristics, and internal reliability and qualification

tests are based on use of dry air as the pressure media. Me-

dia, other than dry air, may have adverse effects on sensor

performance and long–term reliability. Contact the factory for

information regarding media compatibility in your application.

Figure 2 shows the sensor output signal relative to pres-

sure input. Typical, minimum, and maximum output curves

are shown for operation over a temperature range of 0

° to

°C using the decoupling circuit shown in Figure 4. The

output will saturate outside of the specified pressure range.

Figure 4 shows the recommended decoupling circuit for

interfacing the output of the integrated sensor to the A/D in-

put of a microprocessor or microcontroller. Proper decoup-

ling of the power supply is recommended.

Figure 2. Output versus Pressure Differential

MAX

DIFFERENTIAL PRESSURE (kPa)

5.0

4.0

3.0

2.0

4.5

3.5

2.5

1.5

TRANSFER FUNCTION:

Vout = VS*(0.018*P+0.04) ± ERROR

VS = 5.0 Vdc

TEMP = 0 to 85

°C

1.0

0.5

MIN

TYPICAL

Figure 3. Cross–Sectional Diagram

(Not to Scale)

FLUORO SILICONE

GEL DIE COAT

WIRE BOND

LEAD FRAME

DIE

STAINLESS STEEL

METAL COVER

EPOXY

PLASTIC

CASE

DIFFERENTIAL/GAUGE ELEMENT

DIE

BOND

Figure 4. Recommended power supply decoupling

and output filtering.

For additional output filtering, please refer to

Application Note AN1646.

1.0

IPS

470 pF

OUTPUT

+5 V

0.01

GND

Vout

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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