MPXM2102AS datasheet(212/670 Pages) MOTOROLA

212 / 670 page

MPX4100A MPXA4100A SERIES

3–66

Motorola Sensor Device Data

www.motorola.com/semiconductors

Figure 2. Cross Sectional Diagram SOP

(not to scale)

Figure 3. Recommended power supply decoupling

and output filtering.

For additional output filtering, please refer to

Application Note AN1646.

1.0

IPS

470 pF

OUTPUT

+5 V

0.01

GND

Vout

WIRE BOND

STAINLESS

STEEL CAP

THERMOPLASTIC

CASE

DIE BOND

SEALED VACUUM REFERENCE

DIE

FLUORO SILICONE

GEL DIE COAT

LEAD

FRAME

ABSOLUTE ELEMENT

Figure 2 illustrates the absolute sensing chip in the basic

chip carrier (Case 482).

Figure 3 shows the recommended decoupling circuit for

interfacing the output of the integrated sensor to the A/D in-

put of a microprocessor or microcontroller. Proper decoup-

ling of the power supply is recommended.

5.0

4.5

4.0

3.5

3.0

Pressure (ref: to sealed vacuum) in kPa

TYP

MAX

MIN

2.5

2.0

1.5

1.0

0.5

TEMP = 0 to 85

°C

20 kPa TO 105 kPa

MPX4100A

TRANSFER FUNCTION:

Vout = Vs* (.01059*P–.152) ± Error

VS = 5.1 Vdc

Figure 4. Output versus Absolute Pressure

Figure 4 shows the sensor output signal relative to pres-

sure input. Typical, minimum, and maximum output curves

are shown for operation over a temperature range of 0

° to

°C. The output will saturate outside of the specified pres-

sure range.

A fluorosilicone gel isolates the die surface and wire

bonds from the environment, while allowing the pressure

signal to be transmitted to the sensor diaphragm.

The

MPX4100A/MPXA4100A series pressure sensor operat-

ing characteristics, and internal reliability and qualification

tests are based on use of dry air as the pressure media.

Media, other than dry air, may have adverse effects on

sensor performance and long–term reliability. Contact the

factory for information regarding media compatibility in

your application.

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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