MPXM2102AS datasheet(202/670 Pages) MOTOROLA

202 / 670 page

MPX4080D

3–56

Motorola Sensor Device Data

www.motorola.com/semiconductors

ON–CHIP TEMPERATURE COMPENSATION, CALIBRATION and SIGNAL CONDITIONING

Figure 2. Output versus Pressure Differential

Figure 2 shows the sensor output signal relative to

differential pressure input. Typical, minimum, and

maximum output curves are shown for operation over a

temperature range of 0

° to 85°C using the decoupling

circuit shown in Figure 4. The output will saturate out-

side of the specified pressure range.

4.5

3.5

PRESSURE (kPa)

TYP

MAX

MIN

2.5

1.5

0.5

VS = 5.1 Vdc

TA = 25°C

MPX4080

OFFSET

(TYP)

FLUORO SILICONE

GEL DIE COAT

WIRE BOND

LEAD FRAME

DIE

STAINLESS STEEL

METAL COVER

EPOXY PLASTIC

CASE

DIFFERENTIAL/GAUGE ELEMENT

DIE

BOND

Figure 3. Cross–Sectional Diagrams

(Not to Scale)

Figure 3 illustrates the differential sensing chip in the basic

chip carrier (Case 867). A fluorosilicone gel isolates the die

surface and wire bonds from the environment, while allowing

the pressure signal to be transmitted to the sensor dia-

phragm.

The MPX4080D pressure sensor operating character-

istics, internal reliability, and qualification tests are based

on use of dry air as the pressure media. Media, other

than dry air, may have adverse effects on sensor perfor-

mance and long–term reliability. Contact the factory for

information regarding media compatibility in your applica-

tion.

Figure 4 shows the recommended decoupling circuit for in-

terfacing the output of the integrated sensor to the A/D input

of a microprocessor or microcontroller. Proper decoupling of

the power supply is recommended.

Figure 4. Recommended power supply decoupling

and output filtering.

For additional output filtering, please refer to

Application Note AN1646.

1.0

IPS

470 pF

OUTPUT

+5 V

0.01

GND

Vout

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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