 |
поискавой системы для электроныых деталей |
|
|
поискавой системы для электроныых деталей |
|
MPXM2102AS датащи(PDF) 195 Page - Motorola, Inc |
|
|
|||||||||||||||||||||||||||||
MPXM2102AS датащи(HTML) 195 Page - Motorola, Inc |
|
|
195 / 670 page  MPX2202 MPXV2202G SERIES 3–49 Motorola Sensor Device Data www.motorola.com/semiconductors LINEARITY Linearity refers to how well a transducer’s output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 2) or (2) a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. Figure 2. Linearity Specification Comparison LEAST SQUARE DEVIATION PRESSURE (% FULLSCALE) 0 50 100 END POINT STRAIGHT LINE FIT EXAGGERATED PERFORMANCE CURVE LEAST SQUARES FIT STRAIGHT LINE DEVIATION OFFSET ON–CHIP TEMPERATURE COMPENSATION and CALIBRATION Figure 3 shows the output characteristics of the MPX2202/MPXV2202G series at 25 °C. The output is directly proportional to the differential pressure and is essentially a straight line. The effects of temperature on Full Scale Span and Offset are very small and are shown under Operating Characteristics. Figure 3. Output versus Pressure Differential Figure 4. Cross–Sectional Diagrams (Not to Scale) 40 35 30 25 20 15 10 5 0 –5 050 7.25 100 14.5 150 21.75 200 29 PRESSURE SPAN RANGE (TYP) OFFSET kPa PSI VS = 10 Vdc TA = 25°C P1 > P2 25 75 125 175 MAX TYP MIN SILICONE GEL DIE COAT WIRE BOND LEAD FRAME DIFFERENTIAL/GAUGE DIE STAINLESS STEEL METAL COVER EPOXY CASE DIFFERENTIAL/GAUGE ELEMENT DIE BOND SILICONE GEL DIE COAT WIRE BOND LEAD FRAME ABSOLUTE DIE STAINLESS STEEL METAL COVER EPOXY CASE DIE BOND ABSOLUTE ELEMENT P1 P2 P1 P2 Figure 4 illustrates an absolute sensing die (right) and the differential or gauge die in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX2202/MPXV2202G series pressure sensor oper- ating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Me- dia other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
|
ссылки URL |
| Вашему бизинису помогли Аллдатащит? [ DONATE ] |
Что такое Аллдатащит | реклама | контакт | Конфиденциальность | Ссылка на техническое описание | обмен ссыками | поиск по производителю All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
Russian ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
