поискавой системы для электроныых деталей
  Russian  ▼
ALLDATASHEETRU.COM

X  

MPXM2102AS датащи(PDF) 171 Page - Motorola, Inc

номер детали MPXM2102AS
подробное описание детали  Sensor
PDF  670 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
производитель  MOTOROLA [Motorola, Inc]
домашняя страница  http://www.freescale.com
Logo MOTOROLA - Motorola, Inc

MPXM2102AS датащи(HTML) 171 Page - Motorola, Inc

Back Button MPXM2102AS Datasheet HTML 167Page - Motorola, Inc MPXM2102AS Datasheet HTML 168Page - Motorola, Inc MPXM2102AS Datasheet HTML 169Page - Motorola, Inc MPXM2102AS Datasheet HTML 170Page - Motorola, Inc MPXM2102AS Datasheet HTML 171Page - Motorola, Inc MPXM2102AS Datasheet HTML 172Page - Motorola, Inc MPXM2102AS Datasheet HTML 173Page - Motorola, Inc MPXM2102AS Datasheet HTML 174Page - Motorola, Inc MPXM2102AS Datasheet HTML 175Page - Motorola, Inc Next Button
Zoom Inzoom in Zoom Outzoom out
 171 / 670 page
background image
MPX2010 MPXV2010G SERIES
3–25
Motorola Sensor Device Data
www.motorola.com/semiconductors
ON–CHIP TEMPERATURE COMPENSATION and CALIBRATION
Figure 2. Output versus Pressure Differential
MIN
TYP
OFFSET
(TYP)
30
20
15
10
5
25
0
–5
kPa
PSI
2.5
0.362
5
0.725
7.5
1.09
10
1.45
aMAX
SPAN
RANGE
(TYP)
VS = 10 Vdc
TA = 25°C
P1 > P2
Figure 2 shows the output characteristics of the
MPX2010/MPXV2010G series at 25
°C. The output is direct-
ly proportional to the differential pressure and is essentially a
straight line.
The effects of temperature on full scale span and offset are
very small and are shown under Operating Characteristics.
This performance over temperature is achieved by having
both the shear stress strain gauge and the thin–film resistor
circuitry on the same silicon diaphragm. Each chip is dynam-
ically laser trimmed for precise span and offset calibration
and temperature compensation.
Figure 3. Unibody Package — Cross–Sectional
Diagram (not to scale)
SILICONE
DIE COAT
WIRE BOND
LEAD FRAME
DIE
STAINLESS STEEL
METAL COVER
EPOXY
CASE
RTV DIE
BOND
P1
P2
Figure 3 illustrates the differential/gauge die in the basic
chip carrier (Case 344). A silicone gel isolates the die surface
and wire bonds from the environment, while allowing the pres-
sure signal to be transmitted to the silicon diaphragm.
The MPX2010/MPXV2010G series pressure sensor oper-
ating characteristics and internal reliability and qualification
tests are based on use of dry air as the pressure media. Me-
dia other than dry air may have adverse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your application.
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100  ...More


датащи скачать

Go To PDF Page


ссылки URL



Вашему бизинису помогли Аллдатащит?  [ DONATE ] 

Что такое Аллдатащит   |   реклама   |   контакт   |   Конфиденциальность   |   Ссылка на техническое описание    |   обмен ссыками   |   поиск по производителю
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com