MPXM2102AS datasheet(158/670 Pages) MOTOROLA

158 / 670 page

3–12

Motorola Sensor Device Data

www.motorola.com/semiconductors

Integration

ON-CHIP SIGNAL CONDITIONING

To make the designer ’s job even easier, Motorola’s

integrated devices carry sensor technology one step further.

In addition to the on-chip temperature compensation and

calibration offered currently on the 2000 series, amplifier

signal conditioning has been integrated

on-chip in the 4000,

5000 and 6000 series to allow interface directly to any

microcomputer with an on-board A/D converter.

The signal conditioning is accomplished by means of a

four-stage amplification network, incorporating linear bipolar

processing, thin-film metallization techniques, and interac-

tive laser trimming to provide the state-of-the-art in sensor

technology.

1.0

IPS

OUTPUT

+5 V

0.01

Recommended Power Supply Decoupling.

For output filtering recommendations, please refer

to Application Note AN1646.

470 pF

Design Considerations for Different Levels of Sensor Integration

DESIGN ADVANTAGES

DESIGN CONSIDERATIONS

Uncompensated Sensors

High Sensitivity

Device–to–Device Variation in Offset

and Span

Lowest Device Cost

Temperature Compensation

Circuitry Required

Low–Level Output Allows Flexibility

of Signal Conditioning

Requires Signal Conditioning/

Amplification of Output Signal

Relatively Low Input Impedance

(400

Ω Typical)

Temperature Compensated &

Calibrated (2000 Series)

Reduced Device–to–Device

Variations in Offset and Span

Lower Sensitivity Due to Span

Compensation (Compared to

Uncompensated)

Reduced Temperature Drift in Offset

and Span

Priced Higher than Uncompensated

Device

Reasonable Input Impedance

(2K

Ω Typical)

Requires Signal Conditioning/

Amplification of Output Signal

Low Level Output Allows Flexibility in

Signal Conditioning

Integrated Pressure Sensors

(4000, 5000 and 6000 Series)

No Amplification Needed

Direct Interface to MPU

Priced Higher than Compensated/

Uncompensated Device

Signal Conditioning, Calibration of

Span and Offset, Temperature

Compensation Included On–Chip

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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