MPXM2102AS datasheet(342/670 Pages) MOTOROLA

342 / 670 page

AN936

3–196

Motorola Sensor Device Data

www.motorola.com/semiconductors

PORT ADAPTERS

Available Packages

Motorola’s chip–carrier package and available ports for

attachment of 1/8

″ I.D. hose are made from a high

temperature thermoplastic that can withstand temperature

extremes from –50 to 150

°C (see Figure 2). The port adapters

were designed for rivet or 5/32

″ screw attachment to panels,

printed circuit boards or chassis mounting.

Custom Port Adaptor Installation Techniques

The Motorola MPX silicon pressure sensor is available in a

basic chip carrier cell which is adaptable for attachment to

customer specific housings/ports (Case 344 for 4–pin devices

and Case 867 for 6–pin devices).

The basic cell has

chamfered shoulders on both sides which will accept an

O–ring

such

Parker

Seal’s

silicone

O–ring

(p/n#2–015–S–469–40).

Refer

Figure

for

the

recommended O–ring to sensor cell interface dimensions.

The sensor cell may also be glued directly to a custom

housing or port using many commercial grade epoxies or RTV

adhesives which adhere to grade Valox 420, 30% glass

reinforced polyester resin plastic or Union Carbide’s Udel

polysulfone (MPX2300DT1 only).

Motorola recommends

using

Thermoset EP530 epoxy or an equivalent. The epoxy

should be dispensed in a continuous bead around the

case–to–port interface shoulder. Refer to Figure 4. Care must

be taken to avoid gaps or voids in the adhesive bead to help

ensure that a complete seal is made when the cell is joined to

the port. The recommended cure conditions for

Thermoset

EP539 are 15 minutes at 150

°C. After cure, a simple test for

gross leaks should be performed to ensure the integrity of the

cell to port bond.

Submerging the device in water for 5

seconds with full rated pressure applied to the port nozzle and

checking for air bubbles will provide a good indication.

TESTING MPX SERIES PRESSURE SENSORS

Pressure Connection

Testing of pressure sensing elements in the chip carrier

package can be performed easily by using a clamping fixture

which has an O–ring seal to attach to the beveled surface.

Figure 8 shows a diagram of the fixture that Motorola uses to

apply pressure or vacuum to unported elements.

When performing tests on packages with ports, a high

durometer tubing is necessary to minimize leaks, especially in

higher pressure range sensors. Removal of tubing must be

parallel to the port since large forces can be generated to the

pressure port which can break the nozzle if applied at an

angle. Whether sensors are tested with or without ports, care

must be exercised so that force is not applied to the back metal

cap or offset errors can result.

Standard Port Attach Connection

Motorola also offers standard port options designed to

accept readily available silicone, vinyl, nylon or polyethylene

tubing for the pressure connection. The inside dimension of

the tubing selected should provide a snug fit over the port

nozzle. Installation and removal of tubing from the port nozzle

must be parallel to the nozzle to avoid undue stress which may

break the nozzle from the port base. Whether sensors are

used with Motorola’s standard ports or customer specific

housings, care must be taken to ensure that force is uniformly

distributed to the package or offset errors may be induced.

Figure 3. Examples of Motorola Sensors

in Custom Housings

Figure 4. Case to Port Interface

.114

.047

.125

.075

.037R

.021

.210

″

CELL

ADHESIVE BEAD

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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