MPXM2010GS datasheet(283/670 Pages) MOTOROLA

283 / 670 page

MPXAZ4100A SERIES

3–137

Motorola Sensor Device Data

www.motorola.com/semiconductors

Figure 2. Cross Sectional Diagram SOP

(not to scale)

WIRE BOND

STAINLESS

STEEL CAP

THERMOPLASTIC

CASE

DIE BOND

SEALED VACUUM REFERENCE

DIE

FLUORO SILICONE

GEL DIE COAT

LEAD

FRAME

ABSOLUTE ELEMENT

Figure 2 illustrates an absolute sensing chip in the basic chip carrier (Case 482).

5.0

4.5

4.0

3.5

3.0

Pressure (ref: to sealed vacuum) in kPa

TYP

MAX

MIN

2.5

2.0

1.5

1.0

0.5

TEMP = 0 to 85

°C

20 kPa TO 105 kPa

MPXAZ4100A

TRANSFER FUNCTION:

Vout = Vs* (.01059*P–.152) ± Error

VS = 5.1 Vdc

Figure 3. Recommended power supply decoupling

and output filtering.

For additional output filtering, please refer to

Application Note AN1646.

Figure 4. Output versus Absolute Pressure

1.0

IPS

470 pF

OUTPUT

+5 V

0.01

GND

Vout

Figure 4 shows the sensor output signal relative to pres-

sure input. Typical, minimum, and maximum output curves

are shown for operation over a temperature range of 0

° to

°C using the decoupling circuit shown in Figure 3. The

output will saturate outside of the specified pressure range.

A gel die coat isolates the die surface and wire bonds

from the environment, while allowing the pressure signal

to be transmitted to the sensor diaphragm. The gel die

coat and durable polymer package provide a media resis-

tant barrier that allows the sensor to operate reliably in

high humidity conditions as well as environments contain-

ing common automotive media. Contact the factory for

more information regarding media compatibility in your

specific application.

Figure 3 shows the recommended decoupling circuit for in-

terfacing the output of the integrated sensor to the A/D input

of a microprocessor or microcontroller. Proper decoupling of

the power supply is recommended.

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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