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MPXM2010GS датащи(PDF) 241 Page - Motorola, Inc |
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MPXM2010GS датащи(HTML) 241 Page - Motorola, Inc |
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241 / 670 page ![]() MPX4250D SERIES 3–95 Motorola Sensor Device Data www.motorola.com/semiconductors Figure 2. Cross–Sectional Diagram (Not to Scale) FLUOROSILICONE DIE COAT WIRE BOND LEAD FRAME DIE STAINLESS STEEL METAL COVER RTV DIE BOND P1 P2 EPOXY CASE 1.0 mF IPS 470 pF OUTPUT Vs +5 V 0.01 mF GND Vout Figure 3. Recommended power supply decoupling and output filtering. For additional output filtering, please refer to Application Note AN1646. Figure 2 illustrates the differential/gauge pressure sensing chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environ- ment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX4250D series pressure sensor operating charac- teristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long–term reliability. Contact the factory for information regarding media compatibility in your application. Figure 3 shows the recommended decoupling circuit for in- terfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Figure 4 shows the sensor output signal relative to pres- sure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 ° to 85 °C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range. 0 5.0 4.5 4.0 3.5 3.0 PRESSURE in kPa MAX MIN 2.5 2.0 1.5 1.0 0.5 Figure 4. Output versus Differential Pressure TYP TRANSFER FUNCTION: Vout = VS* (0.00369*P + 0.04) ± Error VS = 5.1 Vdc TEMP = 0 to 85 °C Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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