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MPXM2010GS датащи(PDF) 232 Page - Motorola, Inc |
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MPXM2010GS датащи(HTML) 232 Page - Motorola, Inc |
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232 / 670 page ![]() MPX4200A SERIES 3–86 Motorola Sensor Device Data www.motorola.com/semiconductors Figure 2. Cross–Sectional Diagram (Not to Scale) SILICONE DIE COAT WIRE BOND STAINLESS STEEL METAL COVER RTV DIE BOND DIE P1 P2 EPOXY CASE LEAD FRAME SEALED VACUUM REFERENCE 1.0 mF IPS 470 pF OUTPUT Vs +5 V 0.01 mF GND Vout Figure 3. Recommended power supply decoupling and output filtering. For additional output filtering, please refer to Application Note AN1646. Figure 2 illustrates the absolute sensing chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sen- sor diaphragm. The MPX4200A series pressure sensor operating characteristics, and internal reliability and quali- fication tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse ef- fects on sensor performance and long–term reliability. Contact the factory for information regarding media com- patibility in your application. Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D in- put of a microprocessor or microcontroller. Proper decoup- ling of the power supply is recommended. Figure 4 shows the sensor output signal relative to pres- sure input. Typical minimum and maximum output curves are shown for operation over temperature range of 0 ° to 85 °C. The output will saturate outside of the specified pres- sure range. 0 5.0 4.5 4.0 3.5 3.0 MAX MIN 2.5 2.0 1.5 1.0 0.5 Figure 4. Output versus Absolute Pressure TYP TRANSFER FUNCTION: Vout = VS* (0.005 x P–0.04) ± Error VS = 5.1 Vdc TEMP = 0 to 85 °C Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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