MPXM2010GS datasheet(227/670 Pages) MOTOROLA

227 / 670 page

MPX4115A MPXA4115A SERIES

3–81

Motorola Sensor Device Data

www.motorola.com/semiconductors

Figure 2. Cross Sectional Diagram SOP

(not to scale)

Figure 3. Recommended power supply decoupling

and output filtering.

For additional output filtering, please refer to

Application Note AN1646.

1.0

IPS

470 pF

OUTPUT

+5 V

0.01

GND

Vout

WIRE BOND

STAINLESS

STEEL CAP

THERMOPLASTIC

CASE

DIE BOND

SEALED VACUUM REFERENCE

DIE

FLUORO SILICONE

GEL DIE COAT

LEAD

FRAME

ABSOLUTE ELEMENT

Figure 2 illustrates the absolute sensing chip in the basic

chip carrier (Case 482).

Figure 3 shows the recommended decoupling circuit for

interfacing the output of the integrated sensor to the A/D in-

put of a microprocessor or microcontroller. Proper decoup-

ling of the power supply is recommended.

5.0

4.5

4.0

3.5

3.0

Pressure (ref: to sealed vacuum) in kPa

TYP

MAX

MIN

2.5

2.0

1.5

1.0

0.5

Figure 4. Output versus Absolute Pressure

TRANSFER FUNCTION:

Vout = Vs* (.009*P–.095) ± Error

VS = 5.1 Vdc

TEMP = 0 to 85

°C

Figure 4 shows the sensor output signal relative to pres-

sure input. Typical minimum and maximum output curves

are shown for operation over 0 to 85

°C temperature range.

The output will saturate outside of the rated pressure range.

A fluorosilicone gel isolates the die surface and wire

bonds from the environment, while allowing the pressure

signal to be transmitted to the silicon diaphragm. The

MPX4115A/MPXA4115A series pressure sensor operating

characteristics, internal reliability and qualification tests are

based on use of dry air as the pressure media. Media other

than dry air may have adverse effects on sensor perfor-

mance and long–term reliability. Contact the factory for

information regarding media compatibility in your application.

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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