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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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P6002ACMC датащи(PDF) 186 Page - Teccor Electronics |
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P6002ACMC датащи(HTML) 186 Page - Teccor Electronics |
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186 / 212 page  SIDACtor Soldering Recommendations http://www.teccor.com 5 - 24 © 2002 Teccor Electronics +1 972-580-7777 SIDACtor® Data Book and Design Guide Wave Soldering Another common method for soldering components to a PCB is wave soldering. After fluxing the PCB, an adhesive is applied to the respective footprints so that components can be glued in place. Once the adhesive has cured, the board is pre-heated and then placed in contact with a molten wave of solder which has a temperature between 240 °C and 260 °C and permanently affixes the component to the PCB. (Figure 5.8 and Figure 5.10) Although a popular method of soldering, wave soldering does have drawbacks: • A double pass is often required to remove excess solder. • Solder bridging and shadows begin to occur as board density increases. • Wave soldering uses the sharpest thermal gradient. Figure 5.9 Wave Soldering Surface Mount Components Only Figure 5.10 Wave Soldering Surface Mount and Leaded Components Apply glue Screen print glue Place component Cure glue Wave solder PC board Insert leaded components Turn over the PC board Apply glue Place SMDs Cure glue Turn over the PC board Wave solder |
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