STM32L471VG datasheet(213/218 Pages) STMICROELECTRONICS

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STM32L471xx

Package information

215

7.5

Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in

Table 22: General operating conditions.

The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated

using the following equation:

TJ max = TA max + (PD max x ΘJA)

Where:

•

TA max is the maximum ambient temperature in °C,

•

ΘJA is the package junction-to-ambient thermal resistance, in °C/W,

•

PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),

•

PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

PI/O max represents the maximum power dissipation on output pins where:

PI/O max = Σ (VOL × IOL) + Σ ((VDDIOx – VOH) × IOH),

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the

application.

7.5.1

Reference document

JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural

Convection (Still Air). Available from www.jedec.org

7.5.2

Selecting the product temperature range

When ordering the microcontroller, the temperature range is specified in the ordering

information scheme shown in Section 8: Part numbering.

Each temperature range suffix corresponds to a specific guaranteed ambient temperature at

maximum dissipation and, to a specific maximum junction temperature.

As applications do not commonly use the STM32L471xx at maximum dissipation, it is useful

to calculate the exact power consumption and junction temperature to determine which

temperature range will be best suited to the application.

Table 107. Package thermal characteristics

Symbol

Parameter

Value

Unit

ΘJA

Thermal resistance junction-ambient

LQFP64 - 10 × 10 mm / 0.5 mm pitch

°C/W

Thermal resistance junction-ambient

LQFP100 - 14 × 14mm

Thermal resistance junction-ambient

LQFP144 - 20 × 20 mm

Thermal resistance junction-ambient

UFBGA132 - 7 × 7 mm

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