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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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STM32L471VG датащи(PDF) 157 Page - STMicroelectronics |
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STM32L471VG датащи(HTML) 157 Page - STMicroelectronics |
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157 / 218 page  DocID027226 Rev 1 157/218 STM32L471xx Electrical characteristics 199 Figure 24. ADC accuracy characteristics Figure 25. Typical connection diagram using the ADC 1. Refer to Table 63: ADC characteristics for the values of RAIN, RADC and CADC. 2. Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the pad capacitance (refer to Table 58: I/O static characteristics for the value of the pad capacitance). A high Cparasitic value will downgrade conversion accuracy. To remedy this, fADC should be reduced. 3. Refer to Table 58: I/O static characteristics for the values of Ilkg. General PCB design guidelines Power supply decoupling should be performed as shown in Figure 12: Power supply scheme. The 10 nF capacitor should be ceramic (good quality) and it should be placed as close as possible to the chip. |
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