STM32L432KB datasheet(143/149 Pages) STMICROELECTRONICS

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STM32L432KB датащи(PDF) 143 Page - STMicroelectronics

номер детали	STM32L432KB

подробное описание детали	Batch acquisition mode

PDF	149 Pages

Scroll/Zoom	100%

производитель	STMICROELECTRONICS [STMicroelectronics]

домашняя страница	http://www.st.com

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143 / 149 page

DocID028798 Rev 2

143/149

STM32L432KB STM3L432KC

Package information

146

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

7.1

UFQFPN32 package information

Figure 30. UFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat

package outline

1. Drawing is not to scale.

2. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and

solder this backside pad to PCB ground.

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