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STM32L15xRC датащи(PDF) 102 Page - STMicroelectronics

номер детали STM32L15xRC
подробное описание детали  Reset and supply management
PDF  136 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
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STM32L15xRC датащи(HTML) 102 Page - STMicroelectronics

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Electrical characteristics
STM32L151xC STM32L152xC
102/136
DocID022799 Rev 12
Figure 30. Maximum dynamic current consumption on VREF+ supply pin during ADC
conversion
General PCB design guidelines
Power supply decoupling should be performed as shown in Figure 12. The applicable
procedure depends on whether VREF+ is connected to VDDA or not. The 100 nF capacitors
should be ceramic (good quality). They should be placed as close as possible to the chip.
ADC clock
Sampling (n cycles)
Conversion (12 cycles)
Iref+
300µA
700µA
MS36686V1
Table 58. Maximum source impedance RAIN max(1)
Ts
(µs)
RAIN max (kΩ)
Ts (cycles)
fADC=16 MHz(2)
Multiplexed channels
Direct channels
2.4 V < VDDA < 3.6 V 1.8 V < VDDA < 2.4 V 2.4 V < VDDA < 3.6 V 1.8 V < VDDA < 2.4 V
0.25
Not allowed
Not allowed
0.7
Not allowed
4
0.5625
0.8
Not allowed
2.0
1.0
9
1
2.0
0.8
4.0
3.0
16
1.5
3.0
1.8
6.0
4.5
24
3
6.8
4.0
15.0
10.0
48
6
15.0
10.0
30.0
20.0
96
12
32.0
25.0
50.0
40.0
192
24
50.0
50.0
50.0
50.0
384
1. Guaranteed by design.
2. Number of samples calculated for fADC = 16 MHz. For fADC = 8 and 4 MHz the number of sampling cycles can be reduced
with respect to the minimum sampling time Ts (µs),



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