ST7MC1K2-Auto datasheet(355/371 Pages) STMICROELECTRONICS

355 / 371 page

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Package characteristics

355/371

13.2.3

Thermal characteristics

13.2.4

Soldering information

In accordance with the RoHS European directive, all STMicroelectronics packages have

been converted to lead-free technology, named ECOPACK®.

●

ECOPACK® packages are qualified according to the JEDEC STD-020C compliant

soldering profile.

●

Detailed information on the STMicroelectronics ECOPACK® transition program is

available on www.st.com/stonline/leadfree/, with specific technical application notes

covering the main technical aspects related to lead-free conversion (AN2033, AN2034,

AN2035, AN2036).

Forward compatibility

ECOPACK® LQFP packages are fully compatible with Lead (Pb) containing soldering

process (see application note AN2034)

Table 224.

Thermal characteristics

Symbol

Ratings

Value

Unit

RthJA

Package thermal resistance (junction to ambient):

– LQFP44 10x10

–LQFP32 7x7

°C/W

TJmax

Maximum junction temperature(1)

The maximum chip-junction temperature is based on technology characteristics.

150

°C

PDmax

Power dissipation(2)

The maximum power dissipation is obtained from the formula PD = (TJ -TA)/RthJA. The power dissipation of

an application can be defined by the user with the formula: PD =PINT +PPORT where PINT is the chip

internal power (IDD x VDD) and PPORT is the port power dissipation depending on the ports used in the

application.

500

Table 225.

Soldering compatibility (wave and reflow soldering process)

Package

Plating material devices

Pb solder paste

Pb-free solder paste

LQFP 32

NiPdAu (Nickel-Palladium-Gold)

Yes

Yes(1)

Assemblers must verify that the Pb-package maximum temperature (mentioned on the Inner box label) is

compatible with their Lead-free soldering process.

LQFP 44

Sn (pure Tin)

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