EM357-RTR datasheet(223/241 Pages) SILABS

номер детали	EM357-RTR

подробное описание детали	High-Performance, Integrated ZigBee/802.15.4 System-on-Chip

PDF	241 Pages

Scroll/Zoom	100%

производитель	SILABS [Silicon Laboratories]

домашняя страница	http://www.silabs.com

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223 / 241 page

Rev 1.3

223

20. Package

The EM35x package is a plastic 48-pin QFN that is 7 mm x 7 mm. Figure 20.1 illustrates the package drawing.

Figure 20.1. Package Drawing

20.1. QFN48 Footprint Recommendations

Figure 20.2 demonstrates the IPC-7351 recommended PCB Footprint for the EM35x (QFN50P700X700X90-49N).

A ground pad in the bottom center of the package forms a 49th pin.

A 3 x 3 array of non-thermal vias should connect the EM35x decal center shown in Figure 20.2 to the PCB ground

plane through the ground pad. To properly solder the EM35x to the footprint, the Paste Mask layer should have a

3 x 3 array of circular openings at 1.015 mm diameter spaced approximately 1.625 mm (center to center) apart, as

shown in Figure 20.3. This will cause an evenly distributed solder flow and coplanar attachment to the PCB. The

solder mask layer (illustrated in Figure 20.4) should be the same as the copper layer for the EM35x footprint.

For more information on the package footprint, please refer to the appropriate EM35x Reference Design.

EM357-RTR датащи(PDF) 223 Page - Silicon Laboratories