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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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STM32F745VG датащи(PDF) 203 Page - STMicroelectronics |
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STM32F745VG датащи(HTML) 203 Page - STMicroelectronics |
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203 / 227 page  DocID027590 Rev 4 203/227 STM32F745xx STM32F746xx Package information 226 Figure 86. WLCSP143, 4.539x 5.849 mm, 0.4 mm pitch wafer level chip scale package recommended footprint A2 - 0.380 - - 0.0150 - A3(2) - 0.025 - - 0.0010 - b(3) 0.220 0.250 0.280 0.0087 0.0098 0.0110 D 4.504 4.539 4.574 0.1773 0.1787 0.1801 E 5.814 5.849 5.884 0.2289 0.2303 0.2317 e - 0.400 - - 0.0157 - e1 - 4.000 - - 0.1575 - e2 - 4.800 - - 0.1890 - F - 0.2695 - - 0.0106 - G - 0.5245 - - 0.0206 - aaa - - 0.100 - - 0.0039 bbb - - 0.100 - - 0.0039 ccc - - 0.100 - - 0.0039 ddd - - 0.050 - - 0.0020 eee - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Back side coating. 3. Dimension is measured at the maximum bump diameter parallel to primary datum Z. Table 115. WLCSP143, 4.539x 5.849 mm, 0.4 mm pitch wafer level chip scale package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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