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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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STM32F412RG датащи(PDF) 182 Page - STMicroelectronics |
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STM32F412RG датащи(HTML) 182 Page - STMicroelectronics |
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182 / 193 page  Package information STM32F412xE/G 182/193 DocID028087 Rev 4 Figure 79. UFBGA144 - 144-pin, 10 x 10 mm, 0.80 mm pitch, ultra fine pitch ball grid array recommended footprint Note: Non solder mask defined (NSMD) pads are recommended. 4 to 6 mils solder paste screen printing process. Stencil opening is 0.400 mm. Stencil thickness is between 0.100 mm and 0.125 mm. Pad trace width is 0.120 mm. F 0.550 0.600 0.650 0.0177 0.0197 0.0217 ddd - - 0.080 - - 0.0039 eee - - 0.150 - - 0.0059 fff - - 0.080 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 107. UFBGA144 recommended PCB design rules (0.80 mm pitch BGA) Dimension Recommended values Pitch 0.80 mm Dpad 0.400 mm Dsm 0.550 mm typ. (depends on the soldermask registration tolerance) Table 106. UFBGA144 - 144-pin, 10 x 10 mm, 0.80 mm pitch, ultra fine pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. |
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