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STM32F412RG датащи(PDF) 114 Page - STMicroelectronics

номер детали STM32F412RG
подробное описание детали  ARM-Cortex-M4 32b MCUFPU, 125 DMIPS, 1MB Flash, 256KB RAM, USB OTG FS, 17 TIMs, 1 ADC, 17 comm. interfaces
PDF  193 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
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STM32F412RG датащи(HTML) 114 Page - STMicroelectronics

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Electrical characteristics
STM32F412xE/G
114/193
DocID028087 Rev 4
The test results are given in Table 52. They are based on the EMS levels and classes
defined in application note AN1709.
When the application is exposed to a noisy environment, it is recommended to avoid pin
exposition to disturbances. The pins showing a middle range robustness are: PA0, PA1,
PA2, on LQFP144 packages and PDR_ON on WLCSP49.
As a consequence, it is recommended to add a serial resistor (1 k
Ω maximum) located as
close as possible to the MCU to the pins exposed to noise (connected to tracks longer than
50 mm on PCB).
Designing hardened software to avoid noise problems
EMC characterization and optimization are performed at component level with a typical
application environment and simplified MCU software. It should be noted that good EMC
performance is highly dependent on the user application and the software in particular.
Therefore it is recommended that the user applies EMC software optimization and
prequalification tests in relation with the EMC level requested for his application.
Software recommendations
The software flowchart must include the management of runaway conditions such as:
Corrupted program counter
Unexpected reset
Critical Data corruption (control registers...)
Prequalification trials
Most of the common failures (unexpected reset and program counter corruption) can be
reproduced by manually forcing a low state on the NRST pin or the Oscillator pins for 1
second.
To complete these trials, ESD stress can be applied directly on the device, over the range of
specification values. When unexpected behavior is detected, the software can be hardened
to prevent unrecoverable errors occurring (see application note AN1015).
Table 51. EMS characteristics for LQFP144 package
Symbol
Parameter
Conditions
Level/
Class
VFESD
Voltage limits to be applied on any I/O pin
to induce a functional disturbance
VDD = 3.3 V, LQFP144
TA = +25 °C, fHCLK = 100 MHz,
conforms to IEC 61000-4-2
2B
VEFTB
Fast transient voltage burst limits to be
applied through 100 pF on VDD and VSS
pins to induce a functional disturbance
VDD = 3.3 V, LQFP144
TA = +25 °C, fHCLK = 100 MHz,
conforms to IEC 61000-4-4
4B



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