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GXM датащи(PDF) 196 Page - National Semiconductor (TI) |
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GXM датащи(HTML) 196 Page - National Semiconductor (TI) |
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196 / 244 page ![]() www.national.com 196 Revision 3.1 Package Specifications (Continued) 8.1.1 Heatsink Considerations As described previously, Table 8-2 shows the maximum allowed thermal resistance of a heatsink for particular operating environments. The calculated values, defined as θ CA, represent the required ability of a particular heat- sink to transfer heat generated by the processor from its case into the air, thereby maintaining the case tempera- ture at or below 85°C. Because θ CA is a measure of ther- mal resistivity, it is inversely proportional to the heatsink’s ability to dissipate heat or it’s thermal conductivity. Note: A "perfect" heatsink wouldbeabletomaintaina case temperature equal to that of the ambient air inside the system chassis. Looking at Table 8-2, it can be seen that as ambient tem- perature (TA) increases, θCA decreases, and that as power consumption of the processor (P) increases, θ CA decreases. Thus, the ability of the heatsink to dissipate thermal energy must increase as the processor power increases and as the temperature inside the enclosure increases. While θ CA is a useful parameter to calculate, heatsinks are not typically specified in terms of a single θ CA.Thisis because the thermal resistivity of a heatsink is not con- stant across power or temperature. In fact, heatsinks become slightly less efficient as the amount of heat they are trying to dissipate increases. For this reason, heatsinks are typically specified by graphs that plot heat dissipation (in watts) vs. mounting surface (case) temperature rise above ambient (in °C). This method is necessary because ambient and case temperatures fluctuate constantly dur- ing normal operation of the system. The system designer must be careful to choose the proper heatsink by match- ing the required θ CA with the thermal dissipation curve of the device under the entire range of operating conditions in order to make sure that a case temperature of 85°C is never surpassed. Table 8-2. Case-to-Ambient Thermal Resistance Examples @ 85°C Core Voltage (VCC2) Core Frequency Maximum Power θ CA for Different Ambient Temperatures (°C/W) 20°C 25°C 30°C 35°C 40°C 2.9V (Nominal) 266 MHz 7.7W 8.44 7.79 7.14 6.49 5.84 233 MHz 7.1W 9.15 8.45 7.75 7.04 6.34 200 MHz 6.4W 10.16 9.38 8.59 7.81 7.03 180 MHz 6.0W 10.83 10.00 9.17 8.33 7.50 |
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