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STM32F756VG датащи(PDF) 199 Page - STMicroelectronics |
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STM32F756VG датащи(HTML) 199 Page - STMicroelectronics |
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199 / 228 page ![]() DocID027589 Rev 4 199/228 STM32F756xx Package information 227 Figure 80. LQFP100, 14 x 14 mm, 100-pin low-profile quad flat package recommended footprint 1. Dimensions are expressed in millimeters. Marking of engineering samples The following figure gives an example of topside marking orientation versus pin 1 identifier location. Figure 81. LQFP100, 14 x 14 mm, 100-pin low-profile quad flat package top view example 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering samples in production. ST Quality has to be contacted prior to any decision to use these Engineering samples to run qualification activity. |
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