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CF745 датащи(PDF) 202 Page - Microchip Technology |
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CF745 датащи(HTML) 202 Page - Microchip Technology |
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202 / 217 page ![]() PIC16C5X DS30453B-page 202 Preliminary © 1998 Microchip Technology Inc. Package Type: K04-010 18-Lead Ceramic Dual In-line with Window (JW) – 300 mil * Controlling Parameter. n 2 1 R MIN Window Length Window Width Overall Row Spacing Radius to Radius Width Package Width Package Length Tip to Seating Plane Base to Seating Plane Top of Lead to Seating Plane Top to Seating Plane Lead Thickness Shoulder Radius Upper Lead Width Lower Lead Width Number of Pins PCB Row Spacing Dimension Limits Pitch Units eB W2 W1 L E E1 D A1 A2 A B c R B1 n p 0.15 7.24 7.87 0.76 3.33 4.83 0.30 0.38 1.52 0.53 2.59 0.200 0.140 0.385 0.270 0.298 0.900 0.138 0.023 0.111 0.183 0.190 0.130 0.345 0.125 0.255 0.285 0.880 0.015 0.091 0.175 0.210 0.150 0.425 0.150 0.285 0.310 0.920 0.030 0.131 0.190 0.010 0.013 0.055 0.019 0.100 0.300 NOM 0.016 0.008 0.010 0.050 0.098 INCHES* MAX 18 0.021 0.012 0.015 0.060 0.102 22.86 0.19 0.13 8.76 6.48 7.24 22.35 3.18 0.00 2.31 4.45 0.2 0.14 9.78 10.80 0.21 3.49 6.86 7.56 0.57 2.82 4.64 3.81 23.37 NOM MILLIMETERS MIN 0.20 0.25 1.27 0.41 2.49 MAX 0.47 0.25 0.32 1.40 2.54 18 7.62 D W2 E W1 c eB E1 p L A1 B B1 A A2 |
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