Data Sheet P13982EJ2V0DS00

10

PS9713

RECOMMENDED SOLDERING CONDITIONS

(1) Infrared reflow soldering

• Peak reflow temperature

235

°C or below (package surface temperature)

• Time of temperature higher than 210

°C

30 seconds or less

• Number of reflows

Three

• Flux

Rosin flux containing small amount of chlorine (The flux with a

maximum chlorine content of 0.2 Wt % is recommended.)

60 to 120 s

(preheating)

210 ˚C

100 to 160 ˚C

Time (s)

(heating)

to 10 s

to 30 s

235 ˚C (peak temperature)

Recommended Temperature Profile of Infrared Reflow

(2) Dip soldering

• Temperature

260

°C or below (molten solder temperature)

• Time

10 seconds or less

• Number of times

One (Allowed to be dipped in solder including plastic mold portion.)

• Flux

Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of

0.2 Wt % is recommended.)

(3) Cautions

•Fluxes

Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.