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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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STM32L152C6 датащи(PDF) 109 Page - STMicroelectronics |
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STM32L152C6 датащи(HTML) 109 Page - STMicroelectronics |
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109 / 121 page  STM32L151x6/8/B, STM32L152x6/8/B Package characteristics Doc ID 17659 Rev 8 109/121 Figure 37. UFQFPN48 7 x 7 mm, 0.5 mm pitch, package outline 1. Drawing is not to scale. 1. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 1. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this back-side pad to PCB ground. A0B9_ME_V3 D Pin 1 indentifier laser marking area EE D Y D2 E2 Exposed pad area Z 1 48 Detail Z R 0.125 typ. 1 48 L C 0.500x45° pin1 corner A Seating plane A1 b e ddd Detail Y T |
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