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OMAP3530ECBC датащи(PDF) 245 Page - Texas Instruments

номер детали OMAP3530ECBC
подробное описание детали  OMAP3530/25 Applications Processor: OMAP 3 Architecture
PDF  264 Pages
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производитель  TI1 [Texas Instruments]
домашняя страница  http://www.ti.com
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OMAP3530ECBC датащи(HTML) 245 Page - Texas Instruments

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mmcx_clk
mmcx_cmd
mmcx_dat[3:0]
HSSD3
HSSD7
HSSD4
HSSD8
HSSD1
HSSD2
030-106
mmcx_clk
mmcx_cmd
mmcx_dat[3:0]
HSSD5
HSSD5
HSSD6
HSSD6
HSSD1
HSSD2
030-107
6.7.1.5 MMC/SD/SDIO in Standard SD Mode
OMAP3530/25 Applications Processor
www.ti.com
SPRS507F – FEBRUARY 2008 – REVISED OCTOBER 2009
Table 6-136. Y Parameters
CLKD
Y
1 or Even
0.5
Odd
(trunk[CLKD/2])/CLKD
For details about clock division factor CLKD, see the OMAP35x Technical Reference Manual (TRM)
[literature number SPRUF98].
In mmcx, x is equal to 1, 2, or 3.
Figure 6-65. MMC/SD/SDIO – High-Speed SD Mode – Data/Command Receive
In mmcx, x is equal to 1, 2, or 3.
Figure 6-66. MMC/SD/SDIO – High-Speed SD Mode – Data/Command Transmit
Table 6-138 and Table 6-139 assume testing over the recommended operating conditions and electrical
characteristic conditions (see Figure 6-67).
Table 6-137. MMC/SD/SDIO Timing Conditions – Standard SD Mode
TIMING CONDITION PARAMETER
VALUE
UNIT
Standard SD Mode
Input Conditions
tR
Input signal rise time
10
ns
tF
Input signal fall time
10
ns
Output Conditions
CLOAD
Output load capacitance
40
pF
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TIMING REQUIREMENTS AND SWITCHING CHARACTERISTICS
245



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