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STM32F407IG датащи(PDF) 127 Page - STMicroelectronics

номер детали STM32F407IG
подробное описание детали  ARM Cortex-M4 32b MCUFPU, 210DMIPS, up to 1MB Flash/1924KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera
PDF  180 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
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STM32F407IG датащи(HTML) 127 Page - STMicroelectronics

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STM32F405xx, STM32F407xx
Electrical characteristics
Doc ID 022152 Rev 3
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Figure 48.
ADC accuracy characteristics
1.
See also Table 68.
2.
Example of an actual transfer curve.
3.
Ideal transfer curve.
4.
End point correlation line.
5.
ET = Total Unadjusted Error: maximum deviation between the actual and the ideal transfer curves.
EO = Offset Error: deviation between the first actual transition and the first ideal one.
EG = Gain Error: deviation between the last ideal transition and the last actual one.
ED = Differential Linearity Error: maximum deviation between actual steps and the ideal one.
EL = Integral Linearity Error: maximum deviation between any actual transition and the end point
correlation line.
Figure 49.
Typical connection diagram using the ADC
1.
Refer to Table 67 for the values of RAIN, RADC and CADC.
2.
Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the
pad capacitance (roughly 5 pF). A high Cparasitic value downgrades conversion accuracy. To remedy this,
fADC should be reduced.
ai17534
STM32F
VDD
AINx
IL±1 µA
0.6 V
VT
RAIN(1)
Cparasitic
VAIN
0.6 V
VT
RADC(1)
CADC(1)
12-bit
converter
Sample and hold ADC
converter



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