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MPC8572ECLPXATLD датащи(PDF) 122 Page - Freescale Semiconductor, Inc

номер детали MPC8572ECLPXATLD
подробное описание детали  MPC8572E PowerQUICC III Integrated Processor Hardware Specifications
PDF  140 Pages
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производитель  FREESCALE [Freescale Semiconductor, Inc]
домашняя страница  http://www.freescale.com
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MPC8572ECLPXATLD датащи(HTML) 122 Page - Freescale Semiconductor, Inc

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MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 4
122
Freescale Semiconductor
Thermal
19.5.2
Minimum Platform Frequency Requirements for High-Speed
Interfaces
Section 4.4.3.6 “I/O Port Selection” of the MPC8572E PowerQUICC™ III Integrated Host Processor
Family Reference Manual, describes various high-speed interface configuration options. Note that the
CCB clock frequency must be considered for proper operation of such interfaces as described below.
For proper PCI Express operation, the CCB clock frequency must be greater than or equal to:
See Section 21.1.3.2, “Link Width” of the MPC8572E PowerQUICC™ III Integrated Host Processor
Family Reference Manual, for PCI Express interface width details. Note that the “PCI Express link width”
in the above equation refers to the negotiated link width as the result of PCI Express link training, which
may or may not be the same as the link width POR selection.
For proper serial RapidIO operation, the CCB clock frequency must be greater than:
See Section 20.4, “1x/4x LP-Serial Signal Descriptions” of the MPC8572E PowerQUICC™ III Integrated
Host Processor Family Reference Manual, for serial RapidIO interface width and frequency details.
20 Thermal
This section describes the preliminary thermal specifications of the MPC8572E. This is subject to change.
Table 83 shows the thermal characteristics for the package, 1023 33x33 FC-PBGA.
The package uses a 29.6 x 29.6 mm lid that attaches to the substrate. Recommended maximum heat sink
force is 10 pounds force (45 Newton).
Table 83. Package Thermal Characteristics
Rating
Board
Symbol
Value
Unit
Notes
Junction to ambient, natural convection
Single-layer (1s)
RΘJA
15
°C/W
1, 2
Junction to ambient, natural convection
Four-layer (2s2p)
RΘJA
11
°C/W
1, 3
Junction to ambient (at 200 ft./min.)
Single-layer (1s)
RΘJMA
11
°C/W
1, 3
Junction to ambient (ar 200 ft./min.)
Four-layer (2s2p)
RΘJMA
8
°C/W
1, 3
Junction to board
RΘJB
4
°C/W
4
527 MHz
PCI Express link width
()
×
8
----------------------------------------------------------------------------------------------
20.80
()
serial RapidIO interface frequency
()
×
×
serial RapidIO link width
()
×
64
-----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------



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