ST10F272Z2T3 datasheet(139/189 Pages) STMICROELECTRONICS

139 / 189 page

ST10F272Z2

Electrical characteristics

139/189

Based on thermal characteristics of the package and with reference to the power

consumption figures provided in next tables and diagrams, the following product

classification can be proposed. Anyhow, the exact power consumption of the device inside

the application must be computed according to different working conditions, thermal profiles,

real thermal resistance of the system (including printed circuit board or other substrata), I/O

activity, and so on.

25.4

Parameter interpretation

The parameters listed in the following tables represent the characteristics of the

ST10F272Z2 and its demands on the system.

Where the ST10F272Z2 logic provides signals with their respective timing characteristics,

the symbol “CC” for Controller Characteristics, is included in the “Symbol” column. Where

the external system must provide signals with their respective timing characteristics to the

ST10F272Z2, the symbol “SR” for System Requirement, is included in the “Symbol” column.

Table 63.

Thermal characteristics

Symbol

Description

Value (typical)

Unit

ΘJA

Thermal Resistance Junction-Ambient

PQFP 144 - 28 x 28 x 3.4 mm / 0.65 mm pitch

TQFP 144 - 20 x 20 mm / 0.5 mm pitch

TQFP 144 - 20 x 20 mm / 0.5 mm pitch on four layer

FR4 board (2 layers signals / 2 layers power)

°C/W

Table 64.

Package characteristics

Package

Ambient temperature range

CPU frequency range

PQFP 144

–40 / +125°C

1 – 64MHz

TQFP 144

–40 / +125°C

1 – 40MHz

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