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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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EM357-RTR датащи(PDF) 225 Page - List of Unclassifed Manufacturers |
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EM357-RTR датащи(HTML) 225 Page - List of Unclassifed Manufacturers |
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225 / 240 page  EM351 / EM357 19.2 Solder Temperature Profile Figure 19-5 illustrates the solder temperature profile for the EM35x. This temperature profile is similar for other RoHS compliant packages, but manufacturing lines should be programmed with this profile in order to guarantee proper solder connection to the PCB. Figure 19-5. EM35x Reflow Profile Table 19-1 contains the temperature profile parameters. Table 19-1. Solder Reflow Parameters Parameter Value Average Ramp Up Rate (from Tsoakmax to Tpeak) 3°C per second max Minimum Soak Temperature (Tsoakmin) 150°C Maximum Soak Temperature (Tsoakmax) 200°C TL 217°C Time above TL 60 – 150 seconds Tpeak 260 + 0°C Time within 5°C of Tpeak 20 – 40 seconds Ramp Down Rate 6°C per second max Time from 25°C to Tpeak 8 minutes, max 19-3 120-035X-000D Preliminary |
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