STPC12HDYC datasheet(103/111 Pages) STMICROELECTRONICS

поискавой системы для электроныых деталей

STPC12HDYC датащи(PDF) 103 Page - STMicroelectronics

номер детали	STPC12HDYC

подробное описание детали	X86 Core PC Compatible System-on-Chip for Terminals

PDF	111 Pages

Scroll/Zoom	100%

производитель	STMICROELECTRONICS [STMicroelectronics]

домашняя страница	http://www.st.com

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103 / 111 page

DESIGN GUIDELINES

Issue 1.0 - July 24, 2002

103/111

As the PCB acts as a heat sink, the layout of top

and ground layers must be done with care to

maximize the board surface dissipating the heat.

The only limitation is the risk of losing routing

channels. Figure 6-36 and Figure 6-37 show a

routing with a good thermal dissipation thanks to

an optimized placement of power and signal vias.

The ground plane should be on bottom layer for

the best heat spreading (thicker layer than internal

ones) and dissipation (direct contact with air). .

Figure 6-36. Layout for Good Thermal Dissipation - top layer

3.3V ball

2.5V ball (Core / PLLs)

Via

STPC ball

GND ball

Not Connected ball

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