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ST72C171 датащи(PDF) 146 Page - STMicroelectronics

номер детали ST72C171
подробное описание детали  8-BIT MCU with 8K FLASH, ADC, WDG, SPI, SCI, TIMERS SPGAs Software Programmable Gain Amplifiers, OP-AMP
PDF  152 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

ST72C171 датащи(HTML) 146 Page - STMicroelectronics

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10.3 SOLDERING AND GLUEABILITY INFORMATION
Recommended soldering information given only
as design guidelines in Figure 103 and Figure 104.
Recommended glue for SMD plastic packages
dedicated to molding compound with silicone:
s
Heraeus: PD945, PD955
s
Loctite: 3615, 3298
Figure 103. Recommended Wave Soldering Profile (with 37% Sn and 63% Pb)
Figure 104. Recommended Reflow Soldering Oven Profile (MID JEDEC)
10.4 PACKAGE/SOCKET FOOTPRINT PROPOSAL
Table 23. Suggested List of SDIP32 Socket Types
Table 24. Suggested List of SO34 Socket Types
Package / Probe
Adaptor / Socket Reference
Same
Footprint
Socket Type
SDIP32
EMU PROBE
TEXTOOL
232-1291-00
X
Textool
Package / Probe
Adaptor / Socket Reference
Same
Footprint
Socket Type
SO34 EMU PROBE
Emulator Probe includes an adapter with S034 footprint to be sol-
dered on user PCB
XN/A
250
200
150
100
50
0
40
80
120
160
Time [sec]
Temp. [°C]
20
60
100
140
5 sec
COOLING PHASE
(ROOM TEMPERATURE)
PREHEATING
80°C
PHASE
SOLDERING
PHASE
250
200
150
100
50
0
100
200
300
400
Time [sec]
Temp. [°C]
ramp up
2°C/sec for 50sec
90 sec at 125°C
150 sec above 183°C
ramp down natural
2°C/sec max
Tmax=220+/-5°C
for 25 sec



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