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ST72C254G2 датащи(PDF) 128 Page - STMicroelectronics

номер детали ST72C254G2
подробное описание детали  8-BIT MCU WITH SINGLE VOLTAGE FLASH MEMORY, ADC, 16-BIT TIMERS, SPI, I2C INTERFACES
PDF  135 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

ST72C254G2 датащи(HTML) 128 Page - STMicroelectronics

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ST72104G, ST72215G, ST72216G, ST72254G
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14.3 SOLDERING AND GLUEABILITY INFORMATION
Recommended soldering information given only
as design guidelines in Figure 98 and Figure 99.
Recommended glue for SMD plastic packages
dedicated to molding compound with silicone:
s
Heraeus: PD945, PD955
s
Loctite: 3615, 3298
Figure 98. Recommended Wave Soldering Profile (with 37% Sn and 63% Pb)
Figure 99. Recommended Reflow Soldering Oven Profile (MID JEDEC)
14.4 PACKAGE/SOCKET FOOTPRINT PROPOSAL
Table 21. Suggested List of SDIP32 Socket Types
Table 22. Suggested List of SO28 Socket Types
Package / Probe
Adaptor / Socket Reference
Same
Footp rint
Socket Type
SDIP32
EMU PROBE
TEXTOOL
232-1291-00
X
Textool
Package / Probe
Adaptor / Socket Reference
Same
Footp rint
Socket Type
SO28
ENPLAS
OTS-28-1.27-04
Open Top
YAMAICHI
IC51-0282-334-1
Clamshell
EMU PROBE
Adapter from SO28 to SDIP32 footprint (delivered with emulator)
X
SMD to SDIP
250
200
150
100
50
0
40
80
120
160
Time [sec]
Temp. [
°C]
20
60
100
140
5 sec
COOLING PHASE
(ROOM TEMPERATURE)
PREHEATING
80
°C
PHASE
SOLDERING
PHASE
250
200
150
100
50
0
100
200
300
400
Time [sec]
Temp. [
°C]
ramp up
2
°C/sec for 50sec
90 sec at 125
°C
150 sec above 183
°C
ramp down natural
2
°C/sec max
Tmax=220+/-5
°C
for 25 sec



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