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ST72C254G2 датащи(PDF) 108 Page - STMicroelectronics |
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ST72C254G2 датащи(HTML) 108 Page - STMicroelectronics |
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108 / 135 page ![]() ST72104G, ST72215G, ST72216G, ST72254G 108/135 13.6 MEMORY CHARACTERISTICS Subject to general operating conditions for VDD,fOSC, and TA unless otherwise specified. 13.6.1 RAM and Hardware Registers 13.6.2 FLASH Program Memory Notes: 1. Minimum VDD supply voltage without losing data stored in RAM (in in HALT mode or under RESET) or in hardware registers (only in HALT mode). Guaranteed by construction, not tested in production. 2. Data based on characterization results, tested in production at TA=25°C. 3. Up to 16 bytes can be programmed at a time for a 4kBytes FLASH block (then up to 32 bytes at a time for an 8k device) 4. The data retention time increases when the TA decreases. 5. Data based on reliability test results and monitored in production. Symbol Parameter Conditi ons Min Typ Max Unit VRM Data retention mode 1) HALT mode (or RESET) 1.6 V Symbol Parameter Conditions Min Typ Max Unit TA(prog) Programming temperature range 2) 025 70 °C tprog Programming time for 1~16 bytes 3) TA=+25°C8 25 ms Programming time for 4 or 8kBytes TA=+25°C 2.1 6.4 sec tret Data retention 5) TA=+55°C 4) 20 years NRW Write erase cycles 5) TA=+25°C 100 cycles |
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