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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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ST72324 датащи(PDF) 134 Page - STMicroelectronics |
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ST72324 датащи(HTML) 134 Page - STMicroelectronics |
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134 / 161 page  ST72324 134/161 EMC CHARACTERISTICS (Cont’d) True Open Drain Pin Protection The centralized protection (4) is not involved in the discharge of the ESD stresses applied to true open drain pads due to the fact that a P-Buffer and diode to VDD are not implemented. An additional local protection between the pad and VSS (5a & 5b) is implemented to completely absorb the posi- tive ESD discharge. Multisupply Configuration When several types of ground (VSS, VSSA, ...) and power supply (VDD, VAREF, ...) are available for any reason (better noise immunity...), the structure shown in Figure 76 is implemented to protect the device against ESD. Figure 74. Positive Stress on a True Open Drain Pad vs. VSS Figure 75. Negative Stress on a True Open Drain Pad vs. VDD Figure 76. Multisupply Configuration IN VDD VSS (1) (2b) (4) OUT VDD VSS (3b) Main path Path to avoid (5a) (5b) IN VDD VSS (1) (2b) (4) OUT VDD VSS (3b) Main path (3b) (3b) VAREF VSSA VAREF VDD VSS BACK TO BACK DIODE BETWEEN GROUNDS VSSA |
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