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STM32L433CB датащи(PDF) 198 Page - STMicroelectronics

номер детали STM32L433CB
подробное описание детали  Ultra-low-power Arm® Cortex®-M4 32-bit MCUFPU, 100DMIPS, up to 256KB flash, 64KB SRAM, USB FS, LCD, ext. SMPS
PDF  227 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
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STM32L433CB датащи(HTML) 198 Page - STMicroelectronics

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Package information
STM32L433xx
198/227
DS11449 Rev 7
Notes:
1.
Dimensioning and tolerancing schemes conform to ASME Y14.5M-1994.
2.
The Top package body size may be smaller than the bottom package size by as much
as 0.15 mm.
3.
Datums A-B and D to be determined at datum plane H.
4.
To be determined at seating datum plane C.
5.
Dimensions D1 and E1 do not include mold flash or protrusions. Allowable mold flash
or protrusions is “0.25 mm” per side. D1 and E1 are Maximum plastic body size
dimensions including mold mismatch.
6.
Details of pin 1 identifier are optional but must be located within the zone indicated.
7.
All Dimensions are in millimeters.
8.
No intrusion allowed inwards the leads.
9.
Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall
not cause the lead width to exceed the maximum “b” dimension by more than 0.08 mm.
Dambar cannot be located on the lower radius or the foot. Minimum space between
protrusion and an adjacent lead is 0.07 mm for 0.4 mm and 0.5 mm pitch packages.
10. Exact shape of each corner is optional.
11. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm
from the lead tip.
12. A1 is defined as the distance from the seating plane to the lowest point on the package
body.
13. “N” is the number of terminal positions for the specified body size.
14. Values in inches are converted from mm and rounded to 4 decimal digits.
15. Drawing is not to scale.
Figure 44. LQFP100 - Recommended footprint
75
51
50
76
0.5
0.3
16.7
14.3
100
26
12.3
25
1.2
16.7
1
1L_LQFP100_FP_V1



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