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IS25LE512MG-RLLA2:PTY датащи(PDF) 193 Page - Integrated Silicon Solution, Inc

номер детали IS25LE512MG-RLLA2:PTY
подробное описание детали  SERIAL FLASH MEMORY 166/133MHZ MULTI I/O SPI & QUAD I/O QPI DTR INTERFACE WITH ON-CHIP ECC
PDF  194 Pages
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производитель  ISSI [Integrated Silicon Solution, Inc]
домашняя страница  http://www.issi.com
Logo ISSI - Integrated Silicon Solution, Inc

IS25LE512MG-RLLA2:PTY датащи(HTML) 193 Page - Integrated Silicon Solution, Inc

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IS25LE512MG
IS25WE512MG
Integrated Silicon Solution, Inc.- www.issi.com
193
Rev. A6
10/02/2025
11. ORDERING INFORMATION – Valid Part Numbers
IS25LE 512M G - R H L E
:P - TR
PACKING
TR = Tape and Reel
TY = Tray
Blank = Bulk
PBO (Polybenzoxazole) LAYER
:P = Die Overcoat process-PBO layer (Call Factory)
Blank = No PBO layer
TEMPERATURE RANGE
E = Extended (-40°C to +105°C)
A2 = Automotive Grade (-40°C to +105°C)
PACKAGING CONTENT
L = Green Package (RoHS Compliant, Halogen-free) and
TSCA Compliant
PACKAGE Type
L = 8-contact WSON (8x6mm)
M = 16-pin SOIC 300mil
G = 24-ball TFBGA (6x8mm) 4x6 ball array
H = 24-ball TFBGA (6x8mm) 5x5 ball array
W = KGD (Call Factory)
Option
J = Standard
R = Dedicated RESET# in 16-pin SOIC, 24-ball BGA
Q = QE bit set to 1 (Call Factory)
K = Optional 512-byte Page & 256KB Sector (Call Factory)
T = Optional 512-byte Page & 256KB Sector with dedicated
RESET# for SOIC/TFBGA
W = Dedicated RESET# and Dedicated WP# in 24-ball BGA,
5x5 array (Call Factory)
Die Revision
G = Revision G.
Density
512M = 512 Mb
BASE PART NUMBER
IS = Integrated Silicon Solution Inc.
25LE = FLASH, 2.70V ~ 3.60V, QPI & On Chip ECC
25WE = FLASH, 1.65V ~ 1.95V, QPI & On Chip ECC



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