SPSB100 datasheet(196/213 Pages) STMICROELECTRONICS

номер детали	SPSB100

подробное описание детали	Automotive power management IC for highly integrated processors

PDF	213 Pages

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производитель	STMICROELECTRONICS [STMicroelectronics]

домашняя страница	http://www.st.com

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Figure 75. Assembly bottom

10.1

PCB metal and component placement

Evaluation has shown that the best overall performance is achieved using the substrate/PCB layout. QFN devices

should be placed to an accuracy of 0.050 mm on both X and Y axes. Self-centering behavior is highly dependent

on solders and processes, and experiments should be run to confirm the limits of self-centering on specific

processes.

10.2

Solder mask

We recommend that larger power or land area pads are solder mask defined (SMD). This allows the underlying

copper traces to be as large as possible, which helps in terms of current carrying capability and device cooling

capability. When using SMD pads, the underlying copper traces should be at least 0.05 mm larger (on each edge)

than the openings in the solder mask. This allows for layers to be misaligned by up to 0.1 mm on both axes.

Ensure that the solder resists in-between the smaller signal lead areas is at least 0.15 mm wide, due to the high

x/y aspect ratio of the solder mask strip.

SPSB100

PCB layout recommendation

DS14640 - Rev 2

page 196/213

SPSB100 датащи(PDF) 196 Page - STMicroelectronics