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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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STM32MP151AAA3T датащи(PDF) 229 Page - STMicroelectronics |
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STM32MP151AAA3T датащи(HTML) 229 Page - STMicroelectronics |
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229 / 245 page  DS12500 Rev 1 229/245 STM32MP151A Package information 242 7 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 7.1 TFBGA 257 package information Figure 60. TFBGA - 257 balls, 10x10 mm, 0.5/0.65 mm pitch, low profile fine pitch ball grid array package outline 1. Drawing is not to scale. B02Y_ME_V1 D E F1 e1 e2 F2 E2 E1 F1 e2 F2 D2 D1 K H D A B C E F G J L M N P R U T V W A B 1H 1D 1A 1B 1C 1E 1F 1G 1J Peripheral ball matrix pitch 0.5 mm Central ball matrix pitch 0.65 mm 1 2 3 4 5 6 7 8 9 10 11 12 15 13 14 16 17 18 19 1 2 3 4 5 6 7 8 9 A1 ball pad corner b (257 balls) eee M C A B fff M C A A1 A2 SEATING PLANE C ddd C BOTTOM VIEW TOP VIEW SIDE VIEW e1 |
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