PIC12LF1501 datasheet(275/352 Pages) MICROCHIP

275 / 352 page

 2011-2015 Microchip Technology Inc.

DS40001607D-page 275

PIC16(L)F1503

TABLE 28-6:

THERMAL CONSIDERATIONS

TABLE 28-5:

MEMORY PROGRAMMING SPECIFICATIONS

Standard Operating Conditions (unless otherwise stated)

Param.

No.

Sym.

Characteristic

Min.

Typ†

Max.

Units

Conditions

Program Memory

Programming Specifications

D110

VIHH

Voltage on MCLR/VPP pin

8.0

—

9.0

(Note 2)

D112

VPBE

VDD for Bulk Erase

2.7

—

VDDMAX

D113

VPEW

VDD for Write or Row Erase

VDDMIN

—VDDMAX

D114

IPPPGM Current on MCLR/VPP during

Erase/Write

—1.0

—

D115

IDDPGM Current on VDD during

Erase/Write

—5.0

—

Program Flash Memory

D121

Cell Endurance

10K

—

E/W -40

C  TA  +85C

(Note 1)

D122

VPRW

VDD for Read/Write

VDDMIN

—VDDMAX

D123

TIW

Self-timed Write Cycle Time

—

2.5

D124

TRETD

Characteristic Retention

—

Year Provided no other

specifications are violated

D125

EHEFC

High-Endurance Flash Cell

100K

—

E/W 0

C  TA  +60°C, lower

byte last 128 addresses

† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance

only and are not tested.

Note 1:

Self-write and Block Erase.

Required only if single-supply programming is disabled.

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C

 TA  +125°C

Param

No.

Sym.

Characteristic

Typ.

Units

Conditions

TH01

JA

Thermal Resistance Junction to Ambient

C/W

14-pin PDIP package

95.3

C/W

14-pin SOIC package

100

C/W

14-pin TSSOP package

55.3

C/W

16-pin QFN 3X3X0.9mm package

52.3

C/W

16-pin UQFN 3X3X0.5mm package

TH02

JC

Thermal Resistance Junction to Case

32.75

C/W

14-pin PDIP package

C/W

14-pin SOIC package

24.4

C/W

14-pin TSSOP package

C/W

16-pin QFN 3X3X0.9mm package

C/W

16-pin UQFN 3X3X0.5mm package

TH03

TJMAX

Maximum Junction Temperature

150

C

TH04

Power Dissipation

—

PD = PINTERNAL + PI/O

TH05

PINTERNAL Internal Power Dissipation

—

PINTERNAL = IDD x VDD(1)

TH06

PI/O

I/O Power Dissipation

—

PI/O =

 (IOL * VOL) +  (IOH * (VDD - VOH))

TH07

PDER

Derated Power

—

PDER = PDMAX (TJ - TA)/

JA(2)

Note 1:

IDD is current to run the chip alone without driving any load on the output pins.

TA = Ambient Temperature.

TJ = Junction Temperature.

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