ST10F272M datasheet(125/175 Pages) STMICROELECTRONICS

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ST10F272M

Electrical characteristics

125/176

Based on thermal characteristics of the package and with reference to the power

consumption figures provided in the next tables and diagrams, the following product

classification can be proposed. However, the exact power consumption of the device inside

the application must be computed according to different working conditions, thermal profiles,

real thermal resistance of the system (including printed circuit board or other substrata), I/O

activity, and so on.

24.4

Parameter interpretation

The parameters listed in the following tables represent the characteristics of the

ST10F272M and its demands on the system.

Where the ST10F272M logic provides signals with their respective timing characteristics,

the symbol “CC” for Controller Characteristics, is included in the “Symbol” column. Where

the external system must provide signals with their respective timing characteristics to the

ST10F272M, the symbol “SR” for System Requirement, is included in the “Symbol” column.

24.5

DC characteristics

VDD = 5 V ± 10%, VSS = 0 V, TA = -40 to +125°C

Table 54.

Thermal characteristics

Symbol

Description

Value (typical)

Unit

Thermal Resistance Junction-Ambient

PQFP 144 - 28 x 28 x 3.4 mm / 0.65 mm pitch

LQFP 144 - 20 x 20 mm / 0.5 mm pitch

LQFP 144 - 20 x 20 mm / 0.5 mm pitch on four-layer FR4

board (2 layers signals / 2 layers power)

°C/W

Table 55.

Package characteristics

Package

Ambient temperature range

CPU frequency range

PQFP 144

-40 to +125°C

1 to 40 MHz

LQFP 144

Table 56.

DC characteristics

Parameter

Symbol

Limit values

Unit

Test condition

Min

Max

Input low voltage (TTL mode)

(except RSTIN, EA, NMI, RPD, XTAL1,

READY)

VIL

-0.3

0.8

–

Input low voltage (CMOS mode)

(except RSTIN, EA, NMI, RPD, XTAL1,

READY)

VILS

-0.3

0.3 VDD

V–

Input low voltage RSTIN, EA, NMI, RPD

VIL1

-0.3

0.3 VDD

V–

Input low voltage XTAL1 (CMOS only)

VIL2

-0.3

0.3 VDD

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