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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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ST7FL15F1MATRE датащи(PDF) 125 Page - STMicroelectronics |
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ST7FL15F1MATRE датащи(HTML) 125 Page - STMicroelectronics |
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125 / 138 page  ST7L15, ST7L19 125/138 PACKAGE CHARACTERISTICS (cont’d 14.2 SOLDERING INFORMATION In accordance with the RoHS European directive, all STMicroelectronics packages have been con- verted to lead-free technology, named ECO- PACK ™. ■ ECOPACK™ packages are qualified according to the JEDEC STD-020C compliant soldering profile. ■ Detailed information on the STMicroelectronics ECOPACK ™ transition program is available on www.st.com/stonline/leadfree/, with specific technical application notes covering the main technical aspects related to lead-free conversion (AN2033, AN2034, AN2035, AN2036). Forward compatibility: ECOPACK ™ SO packages are fully compatible with a lead (Pb) containing soldering process (see application note AN2034). Table 24. Soldering Compatibility (wave and reflow soldering process) Package Plating Material Pb Solder Paste Pb-free Solder Paste SO NiPdAu (Nickel-Palladium-Gold) Yes Yes |
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