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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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C5NPARCH-RM/D датащи(PDF) 107 Page - NXP Semiconductors |
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C5NPARCH-RM/D датащи(HTML) 107 Page - NXP Semiconductors |
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107 / 114 page  Reflow 107 03 Reflow Typical Reflow Profile for the C-3e Switch Module comprises: 1 Follow the guidelines recommended by your solder paste supplier. Flux requirements must be met for best solderability. 2 The temperature profile should be carefully characterized to ensure uniform temperature across the board and package. Solder ball voiding may be affected by ramp rates and dwell times below and above liquids. 3 A nitrogen atmosphere is not required, but will make the process more robust. It can make a difference for marginally solderable PC board pads. 4 Full convection forced air furnaces work best, but IR, Convection/IR, or vapor phase can be used. Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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