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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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DRA821U4...ALM датащи(PDF) 107 Page - Texas Instruments |
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DRA821U4...ALM датащи(HTML) 107 Page - Texas Instruments |
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107 / 252 page  7.8 Thermal Resistance Characteristics This section provides the thermal resistance characteristics used on this device. For reliability and operability concerns, the maximum junction temperature of the device has to be at or below the TJ value identified in Section 7.3, Recommended Operating Conditions. 7.8.1 Thermal Resistance Characteristics It is recommended to perform thermal simulations at the system level with the worst case device power consumption. NO. PARAMETER DESCRIPTION ALM PACKAGE °C/W (1)(3) AIR FLOW (m/s) (2) T1 RΘJC Junction-to-case 0.54 N/A T2 RΘJB Junction-to-board 2.9 N/A T3 RΘJA Junction-to-free air 12.8 0 T4 Junction-to-moving air 9.1 1 T5 8.1 2 T6 7.5 3 T7 ΨJT Junction-to-package top 0.5 0 T8 0.3 1 T9 0.3 2 T10 0.3 3 T11 ΨJB Junction-to-board 2.8 0 T12 2.8 1 T13 2.7 2 T14 2.7 3 (1) These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards: • JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air) • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Packages (2) m/s = meters per second. (3) °C/W = degrees Celsius per watt. www.ti.com DRA821U-Q1 SPRSP57D – APRIL 2020 – REVISED DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 107 Product Folder Links: DRA821U-Q1 |
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