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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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STM32H757AI датащи(PDF) 248 Page - STMicroelectronics |
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STM32H757AI датащи(HTML) 248 Page - STMicroelectronics |
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248 / 251 page  Package information STM32H757xI 248/251 DS12931 Rev 1 7.6.1 Reference document • JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air). Available from www.jedec.org. • For information on thermal management, refer to application note “Thermal management guidelines for STM32 32-bit Arm Cortex MCUs applications” (AN5036) available from www.st.com. ΘJC Thermal resistance junction-case Thermal resistance junction-ambient WLCSP156 - 4.96 x 4.64 mm /0.35 mm pitch 1 °C/W Thermal resistance junction-ambient UFBGA169 - 7 x 7 mm /0.5 mm pitch 11 Thermal resistance junction-ambient LQFP176 - 24 x 24 mm /0.5 mm pitch 11.2 Thermal resistance junction-ambient LQFP208 - 28 x 28 mm /0.5 mm pitch 11.1 Thermal resistance junction-ambient TFBGA240+25 - 14 x 14 mm / 0.8 mm pitch 7.4 Table 139. Thermal characteristics (continued) Symbol Definition Parameter Value Unit |
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