SPSB0813 datasheet(129/135 Pages) STMICROELECTRONICS

129 / 135 page

3.11.2

Error handling .......................................................... 28

3.11.3

Wake-up from standby modes.............................................. 28

3.12

CAN FD bus transceiver........................................................ 29

3.12.1

Features .............................................................. 29

3.12.2

CAN transceiver supply................................................... 29

3.12.3

CAN transceiver operating modes........................................... 31

3.12.4

CAN error handling ...................................................... 31

3.12.5

Wake-up by CAN ....................................................... 32

3.12.6

CAN receive only mode .................................................. 33

3.12.7

CAN looping mode ...................................................... 33

3.13

Power supply fail ............................................................. 33

3.13.1

Vs supply failure ........................................................ 33

3.13.2

Vsreg supply failure...................................................... 34

3.14

Thermal state machine ........................................................ 35

3.15

Power outputs OUT1..4 ....................................................... 36

3.16

Open-load detection .......................................................... 37

3.17

Overcurrent detection ......................................................... 37

3.18

Current monitor .............................................................. 37

3.19

Constant current mode ........................................................ 37

3.20

Temperature warning and shutdown ............................................. 38

3.21

Thermal clusters .............................................................. 39

3.22

Functional safety management ................................................. 40

Serial peripheral interface (SPI) ...................................................41

4.1

ST SPI ...................................................................... 41

4.1.1

Physical layer .......................................................... 42

4.2

Signal description ............................................................. 42

4.2.1

Clock and data characteristics ............................................. 42

4.2.2

Communication protocol .................................................. 43

4.3

Address definition ............................................................. 46

4.3.1

Information registers ..................................................... 47

4.3.2

Device application registers (RAM) .......................................... 51

4.4

Protocol failure detection ....................................................... 51

4.4.1

Clock monitor .......................................................... 51

4.4.2

SCK polarity (CPOL) check................................................ 51

4.4.3

SCK phase (CPHA) check ................................................ 51

4.4.4

CSN timeout ........................................................... 51

4.4.5

SDI stuck at GND ....................................................... 51

SPSB081

Contents

DS14048 - Rev 1

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