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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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STM8S103F2 датащи(PDF) 106 Page - STMicroelectronics |
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STM8S103F2 датащи(HTML) 106 Page - STMicroelectronics |
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106 / 121 page  Thermal characteristics STM8S103F2 STM8S103F3 STM8S103K3 106/121 DocID15441 Rev 14 12 Thermal characteristics The maximum junction temperature (TJmax) of the device must never exceed the values specified in Table 19: General operating conditions, otherwise the functionality of the device cannot be guaranteed. The maximum junction temperature TJmax, in degrees Celsius, may be calculated using the following equation: TJmax = TAmax + (PDmax x ΘJA) Where: • TAmax is the maximum ambient temperature in ° C •ΘJA is the package junction-to-ambient thermal resistance in ° C/W • PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax) • PINTmax is the product of IDD and VDD, expressed in Watts. This is the maximum chip internal power. • PI/Omax represents the maximum power dissipation on output pins Where: PI/Omax = Σ (VOL*IOL) + Σ((VDD-VOH)*IOH), taking into account the actual VOL/IOL and VOH/IOH of the I/Os at low and high level in the application. 12.1 Reference document JESD51-2 integrated circuits thermal test method environment conditions - natural convection (still air). Available from www.jedec.org. Table 58. Thermal characteristics(1) 1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection environment. Symbol Parameter Value Unit ΘJA Thermal resistance junction-ambient TSSOP20 - 4.4mm 84 °C/W Thermal resistance junction-ambient SO20W (300 mils) 91 Thermal resistance junction-ambient UFQFPN20 - 3 x 3 mm 90 Thermal resistance junction-ambient LQFP32 - 7 x 7 mm 60 Thermal resistance junction-ambient UFQFPN32 - 5 x 5 mm 38 Thermal resistance junction-ambient SDIP32 - 400 mils 60 |
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