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AM6548 датащи(PDF) 140 Page - Texas Instruments |
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AM6548 датащи(HTML) 140 Page - Texas Instruments |
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140 / 282 page ![]() 7.8 Thermal Resistance Characteristics This section provides the thermal resistance characteristics used on this device. For reliability and operability concerns, the maximum junction temperature of the Device has to be at or below the TJ value identified in Section 7.4, Recommended Operating Conditions. 7.8.1 Thermal Resistance Characteristics It is recommended to perform thermal simulations at the system level with the worst case device power consumption NO. NAME DESCRIPTION ACD °C/W(1) (3) AIR FLOW (m/s)(2) T1 RΘJC Junction-to-case 0.2 N/A T2 RΘJB Junction-to-board 3.1 N/A T3 RΘJA Junction-to-free air 12.8 0 T4 Junction-to-moving air 7.4 1 T5 6.5 2 T6 6 3 T7 ΨJT Junction-to-package top 0.1 0 T8 0.1 1 T9 0.1 2 T10 0.1 3 T11 ΨJB Junction-to-board 2.9 0 T12 2.4 1 T13 2.3 2 T14 2.3 3 (1) These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards: • JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air) • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Packages (2) m/s = meters per second. (3) °C/W = degrees Celsius per watt. AM6548, AM6528, AM6526 SPRSP52B – DECEMBER 2019 – REVISED JUNE 2021 www.ti.com 140 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: AM6548 AM6528 AM6526 |
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